Technology Excellence Awards
2018 Technology Excellence Awards
The Technology Excellence Awards will debut this October at PACK EXPO International and Healthcare Packaging EXPO 2018. The awards recognize exhibitors’ innovative technology they have developed that has not been shown at a previous PACK EXPO event.
There was a great response from exhibitors nominating some fantastic and innovative solutions for the awards and we have enlisted some of the top professionals in the industry to review the submissions and narrow them down to just three finalists in each category.
- Stephanie Neil, Editor-In-Chief of OEM Magazine
- Ronald Puvak, Managing Director, Contract Packaging Association
- Matt Reynolds, Editor, Packaging World
- Dr. Bruce Welt, Professor (Packaging Engineering) - Department of Agricultural and Biological Engineering, University of Florida
- Carlos Diaz, Associate Professor (Packaging Science) - College of Applied Science & Technology, Rochester Institute of Technology
- Jane Chase, Executive Director, Institute of Packaging Professionals
- Pat Reynolds, VP Editor Emeritus, Packaging World
Thank you for your contribution!